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W55RFS27R1B Data Sheet SUPER-REGENERATION RF RECEIVER
Table of Content1. GENERAL DESCRIPTION ......................................................................................................... 2 1.1 1.2 W55RFS27R1B Features ............................................................................................... 2 W55RFS27R1B Pad Definition....................................................................................... 3
1.2.1 1.2.2 Pad Description ............................................................................................................3 Mode selection .............................................................................................................4
2.
SYSTEM DESCRIPTION............................................................................................................ 5 2.1 2.2 W55RFS27R1B System Block Diagram......................................................................... 5 W55RFS27R1B Functional Description ......................................................................... 6 W55RFS27R1B Absolute Maximum Ratings ................................................................. 7 W55RFS27R1B DC Characteristics ............................................................................... 8 W55RFS27R1B Ordering Information ............................................................................ 9 W55RFS27R1B Package Information ............................................................................ 9
3.4.1 3.4.2 W55RFS27R1B Bonding Pad List ................................................................................9 W55RFS27R1B Bonding Pad Diagram ......................................................................10
3.
ELECTRONIC CHARACTERISTICS.......................................................................................... 7 3.1 3.2 3.3 3.4
4.
DESIGN INFORMATION .......................................................................................................... 11 4.1 4.2 W55RFS27R1B Reference Design .............................................................................. 11
4.1.1 4.2.1 4.2.2 4.2.3 W55RFS27R1B Application Circuit ............................................................................11 Introduction.................................................................................................................13 Using Smart-DetectorWB in Manual-mode...................................................................13 Using Smart-DetectorWB in uC-mode..........................................................................13
W55RFS27R1B Smart-DetectorWB Function ................................................................ 13
4.3 5.
W55RFS27R1B Layout Guide...................................................................................... 14
REVISION HISTORY ................................................................................................................ 15
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Publication Release Date:June 8, 2005 Revision A2
W55RFS27R1B
1. GENERAL DESCRIPTION
The Winbond W55RFS27R1B is a fully integrated, S-R (Super-regeneration) RF receiver with fullfunction baseband command decoder for R/C vehicles, toys, or wireless data communication applications. The W55RFS27R1B provides two input modes: uC-mode, for general-purpose, micro-controller interfaces to the RF transmitter (the decoder is disabled); and manual-mode, for a 6-function, baseband command decoder and RF receiver that works conveniently with the W55RFS27T1B to provide a simple remote control capability with low cost and high performance. The W55RFS27R1B includes the Smart-DetectorWB function, which makes the W55RFS27R1B the most suitable receiver for mass-produced applications. Smart-DetectorWB overcomes the effects of component deviation and various kinds of environmental problems, such as temperature, moisture, or object-caused, antenna characteristic changes, to maintain maximum sensitivity. The Super-Regenerative RF front-end architecture operates at 27 MHz, 35 MHz, 40 MHz, or 49MHz with a minimum number of external components. In addition, the W55RFS27R1B accommodates a wide range of operating voltages (2.1 V to 5.5 V) and supports 2- or 3-battery R/C applications.
1.1 W55RFS27R1B Features
* * * * * * * * * * * Operating frequencies: 27 MHz, 35 MHz, 40 MHz, 49 MHz Smart-DetectorWB function overcomes component deviation and environmental problems to maintain highest sensitivity Wide operating voltage: 2.1 V ~ 5.5 V S-R (Super-regeneration) demodulation scheme (uC-mode) Receiving data rates up to 1.25Kbps for 50% duty cycle signals (manual-mode) R/C-toy baseband control command decoder, supporting 6 functions; Forward, Backward, Left-turn, Right-turn, and 2 user-defined functions F1 and F2 Minimum current consumption Very low power-down current consumption (uC-mode only) Minimum number of external components Dice form available for PCB bonding Operating temperature: 0C ~ 70C
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W55RFS27R1B
1.2 W55RFS27R1B Pad Definition
1.2.1 Pad Description
PAD NO. I/O FUNCTIONAL DESCRIPTION
SYMBOL
GND CMFB RBIAS RSAW VDDA OSCin OSCout GNDA Reset Mode0 Mode1 TEST F2 F1 R L B F RXD VSPLY
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
Ground O I O Power I O Ground I I I I O/I O/I O/I O/I O/I O/I O/I Power
Ground return path Common-mode feedback capacitor connection Resistor to adjust internal circuit bias Resistor to control internal saw generator Regulated voltage output Oscillator tank input Oscillator tank output Regulator ground return path Reset = 0 resets whole chip, internally pulled high Mode select LSB, please see 1.2.2 for details Mode select MSB, please see 1.2.2 for details TEST = 1 for chip testing; must be set to "0" for regular operation. (manual mode) Decoder F2 output (uC-mode) $ENB ("0" = power down)* (manual mode) Decoder F1 output (uC-mode) Not used; set to "0"* (manual mode) Decoder Right-turn output (uC-mode) HOPCLK; set to "0"* (manual mode) Decoder Left-turn output (uC-mode) $OAGC2; set to "0" * (manual mode) Decoder Backward output (uC-mode) $OAGC1; set to "1" * (manual mode) Decoder Forward output (uC-mode) $OAGC0; set to "0" * Receiver data output Power input
WB
(* For uC-mode control, please see section 4.2 W55RFS27R1B Smart-Detector
Function)
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Publication Release Date:June 8, 2005 Revision A3
W55RFS27R1B
1.2.2 Mode selection
(MODE1,MODE0)
FUNCTION DESCRIPTION
NOTE
(0,0)
Disable Smart-DetectorWB Function uC-mode,
Function evaluation only
(0,1)
Smart-DetectorWB function is externallycontrolled Manual-mode,
Baseband decoder is disabled
(1,0)
Enable half of Smart-DetectorWB function OAGC OFF , HOPPING ON Manual-mode,
Function evaluation only
(1,1)
Enable Smart-DetectorWB function OAGC ON, HOPPING ON
Suitable for mass-production
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W55RFS27R1B
2. SYSTEM DESCRIPTION
2.1 W55RFS27R1B System Block Diagram
Ring osc
Amp.& Rectifier S.C. Filter
OSCin OSCout Oscillator Power RSAW Regulator Saw Generator
Data Slicer RXD MODE0
Power-On Reset
Baseband Decoder MODE1
RESET
F
B
L
R
F1
F2
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Publication Release Date:June 8, 2005 Revision A3
W55RFS27R1B
2.2 W55RFS27R1B Functional Description
Power Regulator
The W55RFS27R1B built-in power regulator provides stable operating performance for operating voltages from 2.1 to 5.5 V, a very wide range of voltages suitable for 2- or 3-battery R/C toys or R/C vehicles.
RF Receiver
The W55RFS27R1B has been implemented using a "Super-Regenerative" receiving architecture. The resulting high noise immunity is suitable for getting higher RF receiving performance in very noisy environments. In addition, the Smart-DetectorWB function overcomes component deviation and various environmental problems to provide the highest receiver sensitivity, making it quite suitable for mass-produced applications.
Baseband Control Function Decoder
The W55RFS27R1B has a built-in, 6-function baseband control function decoder for R/C toys. The six functions include Forward; Backward; Left-turn; Right-turn, and two user-defined functions F1 and F2.
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W55RFS27R1B
3. ELECTRONIC CHARACTERISTICS
3.1 W55RFS27R1B Absolute Maximum Ratings
PARAMETER
RATING
UNIT
Supply Voltage to Ground Potential Applied Input/Output Voltage Power Dissipation (Ta = 70C) Ambient Operating Temperature Storage Temperature
- 0.3 to 6.5 - 0.3 to 6.5 150 0 to 70 -40 to 85
V V mW C C
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device.
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Publication Release Date:June 8, 2005 Revision A3
W55RFS27R1B
3.2 W55RFS27R1B DC Characteristics
(VDD-VSS = 3 V, Ta = 25C; unless otherwise specified)
PARAMETER
SYM.
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Power Supply Operating Voltage Operating Current Stand-by Current Regulated Voltage Digital Input/Output Pin Input High Voltage Input Low Voltage F,B,L,R,F1,F2 Output High Source Current F,B,L,R,F1,F2 Output Low Sink Current RXD Output High Source Current RXD Output Low Sink Current Crystal Oscillator Operation Frequency On-chip Ring Oscillator frequency Baseband Decoder Section Modulation Duty Cycle Received Data Rate MDYT RDTT 50% Duty-cycle Manchester Code 40 50 1.25 60 % Kbps FC TOSC 27 170 200 49.8 250 MHz KHz VIH VIL IOH IOL IOH IOL VOH=0.7 * VDD VOL=0.3 * VDD VOH=0.7 * VDD VOL=0.3 * VDD 0.8*VD
D
VDD IOP ISBY VDDA $ENB= 0
2.1 1.65
1.8
5.5 2.8 2 2.1
V mA A V
-
VDD 0.1*VDD -
V V mA mA mA mA
VSS 6 6 2 2
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W55RFS27R1B
3.3 W55RFS27R1B Ordering Information
The W55RFS27R1B is available in two types: Dice form and Wafer form.
PART NUMBER
PACKAGE
REMARKS
W55RFS27R1B(H) W55RFS27R1B(W)
Dice form Wafer form
3.4 W55RFS27R1B Package Information
3.4.1 W55RFS27R1B Bonding Pad List
--------------------------------------------------------------------------Window : (xl = -929.000, yl = -625.000), (xh = 929.000, yh = 625.000) Windows size : Width = 1858.000, length = 1250.000 =========================================================================== PAD NO PAD NAME PIN NAME X Y --------------------------------------------------------------------------1 * GND *1 -13.000 540.000 2 CMFB 2 -365.950 540.000 3 RBIAS 3 -472.950 540.000 4 RSAW 4 -579.950 540.000 5 VDDA 5 -689.350 540.000 6 VDDA 5 -801.150 540.000 7 OSCin 6 -795.075 -540.000 8 OSCout 7 -667.875 -540.000 9 GNDA 8 -555.150 -540.000 10 reset 9 -128.675 -540.000 11 MODE0 10 -21.675 -540.000 12 MODE1 11 85.325 -540.000 13 TEST 12 192.325 -540.000 14 F2 13 302.925 -540.000 15 F1 14 790.325 540.000 16 R 15 675.875 540.000 17 L 16 561.425 540.000 18 B 17 446.975 540.000 19 F 18 332.525 540.000 20 RXD 19 218.075 540.000 21 VSPLY 20 98.400 540.000 (*: Bonding Sequence start from GND(Pin1)) Publication Release Date:June 8, 2005 Revision A3
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W55RFS27R1B
3.4.2 W55RFS27R1B Bonding Pad Diagram
6
5
4
3
2
LOGO
1
2 1
2 0
1 9
1 8
1 7
1 6
1 5
W55RFS27R1B
7 8 9 1 0 1 1 1 2 1 3 1 4
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W55RFS27R1B
4. DESIGN INFORMATION
4.1 W55RFS27R1B Reference Design
4.1.1 W55RFS27R1B Application Circuit
VDD R3 16K(1%)
C7 10u
+
R2(1%) C4 100nF
19
18
20
17 L
6
5
2
1
21
CMFB
RBIAS
VSPLY
RSAW
VDDA
VDDA
RXD
B
F
GND
R
16
4
3
JP2 1 2 3 4 5 6 Output
ANT1
U1
W55RFS27R1B
MODE0
OSCout
OSCin
GNDA
MODE1
RESET
TEST
F2 14
C1
7
8
9
10
11
12
13
VDDA C6 47n + C5 10u
L0 VDD C2 C3 JP3 1 2 3 MODE0SEL VDD JP4 1 2 3 MODE1SEL
27MHz: C1=15pF, 35MHz: C1=10pF, 40MHz: C1= 7pF, 49MHz: C1= 4pF,
C2=27pF, C2=24pF, C2=16pF, C2=16pF,
C3=27pF, C3=24pF, C3=18pF, C3=18pF,
L0=1.5uH, L0=1.2uH, L0=.82uH, L0=.82uH,
R2=36K R2=39K R2=51K R2=47K
Size A Date: Document Number
15
F1
W55RFS27R1B Application Circuit
Sheet 1 of 1
Rev A1
Wednesday, May 19, 2004
(* Note: The component values are suitable for a 15-cm antenna. Different antenna might change RSAW (R2).)
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Publication Release Date:June 8, 2005 Revision A3
W55RFS27R1B
W55RFS27R1B Application Schematic BOM: Item 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Qty 1 1 1 1 1 2 1 1 1 1 1 1 1 1 Reference ANT1 C1 C2 C3 C4 C7,C5 C6 JP2 JP3 JP4 L0 R2 R3 U1 Part ANTENNA 4pF 16P 18P 100nF 10u 47n Output MODE0SEL MODE1SEL 0.82u 47K(1%) 16K(1%) W55RFS27R1B ________________________________________________________________________________
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W55RFS27R1B
4.2 W55RFS27R1B Smart-DetectorWB Function
4.2.1 Introduction
maintaining the highest sensitivity in different environments. In manual-mode, the control mechanism is built in while, in uC-mode, the OAGC and hopping functions are fixed or controlled by the external MCU. The Smart-DetectorWB function is designed to overcome the effects of component deviation and environmental changes. It enables the onchip OAGC (Oscillator Auto-Gain-Control) and hopping clock functions, dynamically searching for the best operating conditions and
4.2.2
Using Smart-DetectorWB in Manual-mode
a). Set [MODE1:MODE0] to [00] to disable Smart-DetectorWB. Then, select RSAW to provide the highest sensitivity. Note the default values for OAGC and HOPCLK are OAGC[2:0] = {0,1,0} and HOPCLK = 0. b). Set [MODE1:MODE0] to [11] to enable Smart-DetectorWB. Then, OAGC[2:0] change according to the following sequence, and HOPCLK toggles once ("0" => "1" or "1" => "0") every T seconds.
T
start T (1,0,0) T
(1,0,0)
T
(0,1,1) T
(0,0,0)
(0,0,1)
T
(0,1,0)
( T ~= 20ms)
c). When a data packet is received, the W55RFS27R1B holds the current OAGC and HOPCLK settings for around 50ms. When there is no more data input, OAGC and HOPCLK resume sequencing and toggling.
4.2.3
Using Smart-DetectorWB in uC-mode
In uC-mode, OAGC[2:0] and HOPCLK are externally controlled. They can be fixed at specific values or changed to follow the sequence described in manual-mode. Winbond recommends using fixed settings in uC-mode because it can be difficult for the MCU to control these pins. When OAGC and HOPCLK are fixed, the corresponding pins should be set to OAGC[2:0] = (0,1,0) and HOPCLK = 0. Component deviation should be controlled tightly for consistent results in massproduced applications.
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Publication Release Date:June 8, 2005 Revision A3
W55RFS27R1B
When following the sequence above, the switching time T should be based on the data repeat time of the transmitter. Usually, the switching time is twice the repeat time. For example, if a transmitter sends data every 10 ms, then the switching time T should be 20 ms.
4.3 W55RFS27R1B Layout Guide
a). Make the antenna signal input path (ANT->C1->L0,C2,C3) as short as possible, and keep it away from any sources of noise. b). Place the oscillation tank components (L0,C2,C3) as close to each other as possible and as close to the OSCin and OSCout pins as possible. c). Make the oscillator ground return path (GNDA) as short and as wide as possible to GNDA. Keep this path isolated from noise sources too. Antenna L0 Reduce GNDA Loop OSCin OSCout
Pic.1 Graphic representation for a),b),c)
d). Separate the oscillation tank ground from the other ground paths, and connect it directly to GNDA. OSCin Antenna L0 OSCout COB area GND Battery GND Motor Driver & other's Ground
GNDA
Pic.2 Graphic representation for d)
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W55RFS27R1B
5. REVISION HISTORY
VERSION DATE PAGE DESCRIPTION
A1 A2 A3
2004/5/27 2004/7/15 2005/5/30
-
Preliminary version Released version A2 Revised by Brand and add important notice
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or sustain life. Further more, Winbond products are not intended for applications wherein failure of Winbond products could result or lead to a situation wherein personal injury, death or severe property or environmental damage could occur. Winbond customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Winbond for any damages resulting from such improper use or sales.
Headquarters
No. 4, Creation Rd. III, Science-Based Industrial Park, Hsinchu, Taiwan TEL: 886-3-5770066 FAX: 886-3-5665577 http://www.winbond.com.tw/
Winbond Electronics Corporation America
2727 North First Street, San Jose, CA 95134, U.S.A. TEL: 1-408-9436666 FAX: 1-408-5441798
Winbond Electronics (Shanghai) Ltd.
27F, 2299 Yan An W. Rd. Shanghai, 200336 China TEL: 86-21-62365999 FAX: 86-21-62365998
Taipei Office
9F, No.480, Rueiguang Rd., Neihu Chiu, Taipei, 114, Taiwan, R.O.C. TEL: 886-2-8177-7168 FAX: 886-2-8751-3579
Winbond Electronics Corporation Japan
7F Daini-ueno BLDG, 3-7-18 Shinyokohama Kohoku-ku, Yokohama, 222-0033 TEL: 81-45-4781881 FAX: 81-45-4781800
Winbond Electronics (H.K.) Ltd.
Unit 9-15, 22F, Millennium City, No. 378 Kwun Tong Rd., Kowloon, Hong Kong TEL: 852-27513100 FAX: 852-27552064
Please note that all data and specifications are subject to change without notice. All the trade marks of products and companies mentioned in this data sheet belong to their respective owners.
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Publication Release Date:June 8, 2005 Revision A3

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